Insaco provides custom grinding and machining services to fabricate precision parts from sapphire, quartz, and most technical ceramics including alumina, zirconia, silicon carbide, silicon nitride, aluminum nitride, and others.
Applied Ceramics is a fabricator of custom-made ceramic parts designed for semiconductor, solar, fuel cell, oil drilling, nuclear, and numerous other industries. Materials include ACI-995 Alumina, Zirconia, and more. Our extensive experience with precision designs supported by our team of specialists ensures that our customers have the ideal solution to meet the needs of their application. To get started, contact us today!
Refractron partners with companies that have fluid control applications requiring plug, seat, ball & seat or check ball components to name a few and that require a lower cost, strong, tough product of low wear. We manufacture ceramic plungers for high pressure pumps and waterjet cutting. Our aquaculture diffusers are custom manufactured in the shape of discs, plates or tubes constructed from glass-bonded silica, porous alumina or silicon carbide.
Technical Products, Inc. has been manufacturing and distributing a wide variety of ceramics for 30 years. We are capable of meeting the demands of our constantly changing industry with our modern, fully equipped facility. We can produce prototypes as well as full production orders. Visit our website to learn more about our ceramic manufacturing capabilities.
Ceramic machining is the process of designing and creating precision ceramic components. Numerous machining processes are used to produce an effective ceramic product. Forming, burning, and finishing are all steps involved in the ceramic machining process.
Ceramic Machining Processes
The different types of ceramic machining include:
Computer numerical control milling is referred to as CNC milling. Drilling and cutting are closely related to milling, and CNC milling machines can execute both tasks at various angles. CNC milling is a highly configurable automated machining process.
The machinery utilized for this approach relies on computerized controls and specialized cutting tools to gradually remove material from the workpiece to produce the desired output. The four steps of manufacturing for milling are the same as for other machining types. These are the stages:
The creation of the product's CAD (computer-aided design) model
CNC program creation from the CAD model
The CNC milling machine's operational setup
The milling operation's execution
Depending on the cutting operations performed and the characteristics of the cut material, CNC milling machines can be either horizontally or vertically oriented.
Rotating multipoint (or "multi-tooth") cutting tools on the milling machine carry out the required milling operations as directed by the CNC program. Climb milling methods are milling operations in which the machine feeds in the target material while the cutting tool rotates.
Contrarily, traditional milling methods are milling operations that feed the movable workpiece against the rotation of the tool. The product moves on to finishing and post-processing activities when the milling operations are finished.
Dice are extracted from a wafer of semiconducting material using a method called wafer dicing. Scribing and breaking, mechanical sawing, or laser-cutting procedures are used to achieve this separation.
The leftover individual silicon chips from the dicing process are enclosed in chip carriers and then employed in a number of electronic applications. Wafers can typically be tape mounted on a film frame for easier handling.
The wafers can also be wax mounted to the glass to improve cutting precision. The various wafer dicing operations include:
Cutting a bevel: The target substrate is given a V-shaped groove or chamfer as a result of this cutting operation.
Burr mitigation: The burr produced on the cut edge of the target material can be reduced using a combination of machining tools and speeds.
Chip control: To ensure edge chipping levels stay within specifications, operators closely monitor variables like feed, speed, and coolant flow.
Scribing: Marking the wafer with a scribe can help break operations later.
Wraparound metallization: In microwave circuits, wraparound metallization has strong grounding characteristics.
Cleaning and packing: After the dicing procedures are finished, a thorough die cleaning ensures that the finished product is spotless and ready for packaging.
Some procedures may apply a protective layer to the target substrate before dicing starts.
Surface grinding is a typical procedure for smoothing out and refining. A grinding wheel or disc smooths off the target material's surface in this operation and then refines the workpiece's surface and edges to extremely precise tolerances.
Surface grinders come in three different categories:
Horizontal spindle grinders: These grinding procedures produce highly accurate results because the flat edge of the grinding wheel makes touch with the workpiece
Vertical spindle grinders: Vertical spindle or wheel-face grinders, as opposed to horizontal spindle grinders, remove a lot of material at once. The grinding wheel's face, not its edge, makes contact with the desired surface.
Single- or double-disc grinders: Disc grinders can be oriented horizontally or vertically and frequently grind two sides of a workpiece simultaneously.
During core drilling, a cylindrical core is taken out of the drill hole. There are three essential components to a core drill:
drill bit or bits
Usually, the drill bit(s) are coated with diamond or carbide. Concrete core drills often employ drill bits with diamond coatings, whereas masonry core drills typically use bits with carbide coatings.
Today's core drills come in a wide variety. These range from tiny core drills used by homeowners for DIY projects to enormous core drills used to cut concrete in large-scale construction projects. Core drilling enables the safe removal and examination of a material's core. The core is disregarded in other instances where the goal is merely the creation of a hole.
Ceramic Manufacturing Power Pages
Alumina ceramic is an industrial ceramic that has high hardness, is long wearing, and can only be formed by diamond grinding. It is manufactured from bauxite and can be shaped using injection molding, die pressing, isostatic pressing, slip casting, and extrusion...
A ceramic insulator is a non-conductive insulator made from red, brown, or white porous clay that provides a bridge between electronic components and has high dielectric strength and constant and low electrical loss. They are easy to maintain and...
Ceramic machining refers to the manufacture of ceramic materials into finished usable products. Machining involves the continual removal of material from the workpiece, in this case, ceramic material...
Zirconia Ceramic and ZTA
Zirconia Ceramics, or zirconium dioxide ceramics, are exceptionally strong technical ceramic materials with excellent hardness, toughness, and corrosion resistance without the brittleness common to other ceramic materials...
Acid etching, also known as chemical etching or photo etching, is the process of cutting a hard surface like metal by means of a specially formulated acid for the process of etching in order to allow for the creation of a design onto the metal...
Metal etching is a metal removal process that uses various methods to configure complex, intricate, and highly accurate components and shapes. Its flexibility allows for instantaneous changes during processing...